{"id":12654,"date":"2021-09-27T08:56:18","date_gmt":"2021-09-27T08:56:18","guid":{"rendered":"https:\/\/fischer.e-novision.ch\/en\/technologies\/miniaturization\/"},"modified":"2022-01-27T09:52:09","modified_gmt":"2022-01-27T09:52:09","slug":"miniaturization","status":"publish","type":"technologies","link":"https:\/\/fischer.e-novision.ch\/it\/technologies\/miniaturization\/","title":{"rendered":"Miniaturization"},"content":{"rendered":"
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Miniaturization<\/h1>\n

Capturing data in ever-smaller devices with lighter, more capable, ultra-miniature solutions \u2013 while maximizing ergonomics and robustness<\/p>\n <\/div>\n<\/section>\n\n\n\n

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The multiplication of sensors \u2013 reflecting a growing need for data acquisition and transmission \u2013 as well as the constant scale reduction of electronic components are the two main innovation drivers for ever-smaller, lighter and more capable high-density, ultra-miniature connectors and electronic solutions.<\/h4>\n \n
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Following Moore\u2019s law, the miniaturization of electronics has meant moving away from bulky devices to fully mobile versions, including body-worn electronics. The challenge is to maximize the functionalities and performances of electronics while containing or maintaining their footprint to a minimum.<\/p>\n

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To overcome such hurdles, our engineers have become experts in Printed-Circuit-Board (PCB) and connector design, as well as in system integration that increases density and reduces solution packaging (size, weight, ergonomics).<\/p>\n\n<\/div>\n\n

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 <\/p>\n

Following Moore\u2019s law, the miniaturization of electronics has meant moving away from bulky devices to fully mobile versions, including body-worn electronics. The challenge is to maximize the functionalities and performances of electronics while containing or maintaining their footprint to a minimum.<\/p>\n

 <\/p>\n

To overcome such hurdles, our engineers have become experts in Printed-Circuit-Board (PCB) and connector design, as well as in system integration that increases density and reduces solution packaging (size, weight, ergonomics).<\/p>\n\n<\/div>\n\n

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 <\/p>\n

Following Moore\u2019s law, the miniaturization of electronics has meant moving away from bulky devices to fully mobile versions, including body-worn electronics. The challenge is to maximize the functionalities and performances of electronics while containing or maintaining their footprint to a minimum.<\/p>\n

 <\/p>\n

To overcome such hurdles, our engineers have become experts in Printed-Circuit-Board (PCB) and connector design, as well as in system integration that increases density and reduces solution packaging (size, weight, ergonomics).<\/p>\n\n<\/div>\n \n <\/div>\n <\/div>\n \n <\/div>\n <\/div>\n <\/div>\n <\/div>\n <\/div>\n \n\n

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The multiplication of sensors \u2013 reflecting a growing need for data acquisition and transmission \u2013 as well as the constant scale reduction of electronic components are the two main innovation drivers for ever-smaller, lighter and more capable high-density, ultra-miniature connectors and electronic solutions.<\/h4>\n \n
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\n
\n
\n \n
\n

 <\/p>\n

Following Moore\u2019s law, the miniaturization of electronics has meant moving away from bulky devices to fully mobile versions, including body-worn electronics. The challenge is to maximize the functionalities and performances of electronics while containing or maintaining their footprint to a minimum.<\/p>\n

 <\/p>\n

To overcome such hurdles, our engineers have become experts in Printed-Circuit-Board (PCB) and connector design, as well as in system integration that increases density and reduces solution packaging (size, weight, ergonomics).<\/p>\n\n<\/div>\n\n

\n

 <\/p>\n

Following Moore\u2019s law, the miniaturization of electronics has meant moving away from bulky devices to fully mobile versions, including body-worn electronics. The challenge is to maximize the functionalities and performances of electronics while containing or maintaining their footprint to a minimum.<\/p>\n

 <\/p>\n

To overcome such hurdles, our engineers have become experts in Printed-Circuit-Board (PCB) and connector design, as well as in system integration that increases density and reduces solution packaging (size, weight, ergonomics).<\/p>\n\n<\/div>\n\n

\n

 <\/p>\n

Following Moore\u2019s law, the miniaturization of electronics has meant moving away from bulky devices to fully mobile versions, including body-worn electronics. The challenge is to maximize the functionalities and performances of electronics while containing or maintaining their footprint to a minimum.<\/p>\n

 <\/p>\n

To overcome such hurdles, our engineers have become experts in Printed-Circuit-Board (PCB) and connector design, as well as in system integration that increases density and reduces solution packaging (size, weight, ergonomics).<\/p>\n\n<\/div>\n \n <\/div>\n <\/div>\n <\/div>\n <\/div>\n <\/div>\n <\/div>\n <\/div>\n \n

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The multiplication of sensors \u2013 reflecting a growing need for data acquisition and transmission \u2013 as well as the constant scale reduction of electronic components are the two main innovation drivers for ever-smaller, lighter and more capable high-density, ultra-miniature connectors and electronic solutions.<\/h4>\n \n
\n
\n
\n
\n \n
\n

 <\/p>\n

Following Moore\u2019s law, the miniaturization of electronics has meant moving away from bulky devices to fully mobile versions, including body-worn electronics. The challenge is to maximize the functionalities and performances of electronics while containing or maintaining their footprint to a minimum.<\/p>\n

 <\/p>\n

To overcome such hurdles, our engineers have become experts in Printed-Circuit-Board (PCB) and connector design, as well as in system integration that increases density and reduces solution packaging (size, weight, ergonomics).<\/p>\n\n<\/div>\n\n

\n

 <\/p>\n

Following Moore\u2019s law, the miniaturization of electronics has meant moving away from bulky devices to fully mobile versions, including body-worn electronics. The challenge is to maximize the functionalities and performances of electronics while containing or maintaining their footprint to a minimum.<\/p>\n

 <\/p>\n

To overcome such hurdles, our engineers have become experts in Printed-Circuit-Board (PCB) and connector design, as well as in system integration that increases density and reduces solution packaging (size, weight, ergonomics).<\/p>\n\n<\/div>\n\n

\n

 <\/p>\n

Following Moore\u2019s law, the miniaturization of electronics has meant moving away from bulky devices to fully mobile versions, including body-worn electronics. The challenge is to maximize the functionalities and performances of electronics while containing or maintaining their footprint to a minimum.<\/p>\n

 <\/p>\n

To overcome such hurdles, our engineers have become experts in Printed-Circuit-Board (PCB) and connector design, as well as in system integration that increases density and reduces solution packaging (size, weight, ergonomics).<\/p>\n\n<\/div>\n \n <\/div>\n <\/div>\n <\/div>\n <\/div>\n <\/div>\n <\/div>\n <\/div>\n <\/div>\n

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Your have very specific requirements?<\/p>\n

\n Tailored solutions<\/span><\/a>\n\n <\/div>\n <\/div>\n
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Looking for a rugged connectivity solution?<\/p>\n \n Connectors<\/span>\n <\/span>\n <\/a>\n \n Cable assembly<\/span>\n <\/span>\n <\/a>\n \n Electronics<\/span>\n <\/span>\n <\/a>\n <\/div>\n <\/div>\n <\/div>\n <\/section>\n<\/div>\n\n\n