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Fischer Connectors continues to push the boundaries of high-density miniaturization in connectivity. Its ultra-miniature, rugged series of connectors, cable assemblies and electronic solutions has been extended to help engineers add more functionality and meet high-speed data acquisition and transmission requirements in applications with extreme limitations in space, even in harsh operating environments.<\/strong><\/p>\n <\/p>\n The flagship product line Fischer MiniMax\u2122 Series, which already includes one of the smallest and densest connectors in the world, now includes three connectors and their associated cables with new options in pin layout, body size and data speed:<\/p>\n [\/vc_column_text][\/vc_column][\/vc_row][vc_row][vc_column offset=”vc_col-lg-7″][vc_column_text]<\/p>\n \u00a0<\/strong><\/p>\n [\/vc_column_text][\/vc_column][vc_column offset=”vc_col-lg-5″][vc_single_image image=”29496″ img_size=”full” add_caption=”yes” alignment=”center” onclick=”link_image”][\/vc_column][vc_column][vc_column_text]<\/p>\n <\/p>\n <\/p>\n <\/p>\n The increased density and optimized packaging factor offered by the MiniMax series apply to a varied array of lightweight and compact solutions, from various connector configurations, through cable assemblies<\/strong> with straight, right-angle or 60\u00b0 overmolding, to electronic solutions<\/strong> including hubs, flash drives and flex PCB circuits tailored to the size, weight and power (SWaP) requirements of entire electronic systems and ecosystems.<\/p>\n <\/p>\n This provides OEM engineers with more flexibility in terms of design when it comes to choosing from different connectivity solutions in line with specific system-level and field-application engineering<\/strong> requirements, harsh operating environments, as well as cost-efficiency<\/strong> criteria.<\/p>\n <\/p>\n Smaller connectivity yields big advantages in terms of design integration. For example, the 12 mm diameter receptacle (size 08) with up to 24 power and signal contacts represents up to a 45% space saving<\/strong> compared to standard receptacles with a similar number of contacts. The external dimensions of electronic devices are affected by the growing demand for sensors and mobile (or wearable) electronics as well as for autonomous robotics and vehicles. This implies ever-lighter components. With up to 75% weight saving<\/strong>, the Fischer MiniMax\u2122 Series achieves both size and weight reduction, maximizing performances while minimizing the integration burden.<\/p>\n <\/p>\n One of the smallest and densest connectors in the world<\/strong> is a Fischer MiniMax\u2122 connector. The connector in size 06 includes up to 12 power and signal contacts in a footprint of just 10 mm. This represents a density factor of 0.83<\/strong>, a unique technological feature for a connector with standard 0.5 mm contacts. The density factor is equal to the receptacle diameter divided by the number of contacts available in that receptacle size.<\/p>\n [\/vc_column_text][vc_empty_space][\/vc_column][\/vc_row][vc_row][vc_column offset=”vc_col-lg-5″][vckit_carousel show_arrow=”” show_dot=”yes” dot_position=”inside” tutorial=”” dot_color=”#e2e8f0″ dot_active_color=”#d90404″][vckit_carousel_item][vc_single_image image=”29551″ img_size=”full” add_caption=”yes” alignment=”center” onclick=”link_image”][\/vckit_carousel_item][vckit_carousel_item][vc_single_image image=”29491″ img_size=”full” add_caption=”yes” alignment=”center” onclick=”link_image”][\/vckit_carousel_item][\/vckit_carousel][\/vc_column][vc_column offset=”vc_col-lg-7″][vc_column_text]<\/p>\n When ruggedized for durable life cycles, lightweight and ultra-miniature solutions further increase flexibility and facilitates design integration for demanding applications. The main reliability features<\/strong> of the Fischer MiniMax\u2122 Series are 5,000 mating cycles, 360\u00b0 EMC shielding, IP68 sealing -20m\/24h, gas tightness to 10-6<\/sup> mbar l\/s, high corrosion resistance, operating temperatures from -40 \u00b0C to +135 \u00b0C, blind mating, three secure locking mechanisms (quick-release, push-pull, screw), and cable assemblies with straight or angled bend relief overmolding.<\/p>\n [\/vc_column_text][\/vc_column][\/vc_row][vc_row][vc_column][vc_empty_space][\/vc_column][\/vc_row][vc_row][vc_column][vc_column_text]<\/p>\n Jonathan Brossard, Fischer Connectors CEO<\/strong>: \u201cSpecial know-how, skillsets and miniaturization and ruggedization processes and techniques are required from our R&D and Operations teams to design and manufacture our ultra-miniature, high-density and high-speed connectivity solutions. We are very proud we can provide the design engineering community with some of the smallest and densest connectivity solutions in the world, combined with unparalleled ergonomics and robustness.\u201d<\/p>\n <\/p>\n J\u00e9r\u00f4me Dabonneville, Fischer Connectors CTO<\/strong>: \u201cThe multiplication of sensors \u2013 reflecting a growing need for data acquisition and transmission \u2013 as well as the constant scale reduction of electronic components are the two main innovation drivers for ever-smaller, lighter and more capable high-density, ultra-miniature connectors, cable assemblies and electronic solutions. Demands for connectivity tailored to electronic devices and systems ensuring signal integrity and maximizing power & data functionality, performance and reliability, while containing or maintaining footprint to a minimum, are on the rise. The new solutions we are now making available to the market completes our Fischer MiniMax\u2122 range in this direction. Tested to IEC, EIA and MIL-SPEC quality and reliability standards, they allow design engineers to accelerate innovative designs for various challenging applications in defense & security, UAVs and industrial instrumentation, to name just a few of the harsh operating environments for which our ultra-miniature connectivity solutions are particularly well suited.\u201d<\/p>\n <\/p>\n <\/p>\n Lidar (laser imaging detection and ranging) for Unmanned Aerial Vehicles (UAVs).<\/strong> YellowScan<\/a>, based in southern France, designs lightweight UAV-lidar mapping solutions for surveying operations such as a survey of ruins, topographic studies of road and rail corridors, and an airborne survey of the Amazon in French Guyana that maps both canopy and terrain to study the impacts of climate change. The key connectivity requirements for lidar systems such as the YellowScan\u2019s Mapper using three Fischer MiniMax\u2122 connectors are: space and weight, rugged material, vibration resistance, dust and rain proofing with high IP sealing, large pin count and EMI shielding.<\/p>\n [\/vc_column_text][\/vc_column][\/vc_row][vc_row][vc_column offset=”vc_col-lg-7″][vc_column_text]<\/p>\n YellowScan\u2019s Mapper uses three Fischer Minimax\u2122 connectors: 4 pins for the external power port; 24 pins (RJ45 and Universal Asynchronous Receiver Transmitter, UART) for the LiveStation port; and 19 pins (USB and General Purpose Input\/Output, GPIO) for the optional camera port.\u00a0 <\/em><\/p>\n [\/vc_column_text][\/vc_column][vc_column offset=”vc_col-lg-5″][vc_single_image image=”29511″ img_size=”full” add_caption=”yes” alignment=”center” onclick=”link_image”][\/vc_column][vc_column][vc_empty_space][\/vc_column][\/vc_row][vc_row][vc_column offset=”vc_col-lg-5″][vc_single_image image=”29506″ img_size=”full” add_caption=”yes” alignment=”center” onclick=”link_image”][\/vc_column][vc_column offset=”vc_col-lg-7″][vc_column_text]<\/p>\n Strain gauge sensors.<\/strong> To ensure that machines and systems in robotics, medical technology or the automotive industry are operated safely and precisely, the forces and torques need to be monitored constantly. One proven methodology for obtaining reliable results is strain gauge technology. Since the sensors are very small, connectivity also has to be suitably minimized, and data transmission must remain stable even when there are high vibrations. The engineers of ME-Me\u00dfsysteme<\/a> based in Germany have chosen the compact and robust Fischer MiniMax\u2122 Series to meet these requirements in data transmission and vibration resistance.<\/p>\n [\/vc_column_text][\/vc_column][\/vc_row]<\/p>\n","protected":false},"featured_media":29501,"menu_order":0,"template":"","departments-jobs-categories":[],"news-and-blog-categories":[63],"class_list":["post-29476","news-and-blog","type-news-and-blog","status-publish","has-post-thumbnail","hentry","news-and-blog-categories-product-news"],"acf":{"author":false,"keyword":"","all_industries":true,"industries":false,"all_technologies":true,"technologies":false,"all_solutions":false,"solutions":[],"all_products":false,"produits":false,"interest_title":"This may be of interest to you","interest_links":["https:\/\/fischer.e-novision.ch\/he\/technologies\/miniaturization\/","https:\/\/fischer.e-novision.ch\/he\/?post_type=technologies&p=5139"],"title_subscribe":"Subscribe to our newsletter","email_placeholder":"Your e-mail"},"_links":{"self":[{"href":"https:\/\/fischer.e-novision.ch\/he\/wp-json\/wp\/v2\/news-and-blog\/29476"}],"collection":[{"href":"https:\/\/fischer.e-novision.ch\/he\/wp-json\/wp\/v2\/news-and-blog"}],"about":[{"href":"https:\/\/fischer.e-novision.ch\/he\/wp-json\/wp\/v2\/types\/news-and-blog"}],"version-history":[{"count":7,"href":"https:\/\/fischer.e-novision.ch\/he\/wp-json\/wp\/v2\/news-and-blog\/29476\/revisions"}],"predecessor-version":[{"id":33818,"href":"https:\/\/fischer.e-novision.ch\/he\/wp-json\/wp\/v2\/news-and-blog\/29476\/revisions\/33818"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/fischer.e-novision.ch\/he\/wp-json\/wp\/v2\/media\/29501"}],"wp:attachment":[{"href":"https:\/\/fischer.e-novision.ch\/he\/wp-json\/wp\/v2\/media?parent=29476"}],"wp:term":[{"taxonomy":"departments-jobs-categories","embeddable":true,"href":"https:\/\/fischer.e-novision.ch\/he\/wp-json\/wp\/v2\/departments-jobs-categories?post=29476"},{"taxonomy":"news-and-blog-categories","embeddable":true,"href":"https:\/\/fischer.e-novision.ch\/he\/wp-json\/wp\/v2\/news-and-blog-categories?post=29476"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}\n
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Increased density and optimized packaging factors for design flexibility<\/strong><\/h4>\n
CEO and CTO quotes<\/strong><\/h4>\n
Two use cases: Robust, high-density miniaturization applied<\/strong><\/h4>\n